Package / Case  

FCBGA-325

Mounting Type  

Surface Mount

Surface Mount  

YES

Supplier Device Package  

325-FCBGA (11x11)

Number of Terminals  

325

Shipping Restrictions  

This product may require additional documentation to export from the United States.

RoHS  

N

Number of Logic Elements  

56520 LE

Number of I/Os  

200 I/O

Supply Voltage-Min  

1.2 V

Minimum Operating Temperature  

0 C

Maximum Operating Temperature  

+ 85 C

Mounting Styles  

SMD/SMT

Moisture Sensitive  

Yes

Factory Pack QuantityFactory Pack Quantity  

176

Tradename  

IGLOO2

Supply Voltage-Max  

1.2 V

Package  

Tray

Base Product Number  

M2GL060

Mfr  

Microchip Technology

Product Status  

Active

Package Description  

BGA,

Package Style  

GRID ARRAY

Package Body Material  

PLASTIC/EPOXY

Supply Voltage-Nom  

1.2 V

Reflow Temperature-Max (s)  

20

Operating Temperature-Max  

85 °C

Rohs Code  

No

Manufacturer Part Number  

M2GL060TS-1FCS325

Package Code  

BGA

Package Shape  

SQUARE

Part Life Cycle Code  

Active

Ihs Manufacturer  

MICROSEMI CORP

Risk Rank  

5.26

Series  

M2GL060TS

Packaging  

Tray

Operating Temperature  

0°C ~ 85°C (TJ)

HTS Code  

8542.39.00.01

Voltage - Supply  

1.2 V

Terminal Position  

BOTTOM

Terminal Form  

BALL

Peak Reflow Temperature (Cel)  

240

Reach Compliance Code  

compliant

JESD-30 Code  

S-PBGA-B325

Temperature Grade  

OTHER

Programmable Logic Type  

FIELD PROGRAMMABLE GATE ARRAY

Number of Logic Elements/Cells  

56520

Total RAM Bits  

1869824

Number of Transceivers  

2 Transceiver